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In today's complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on" analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive
Published in:
Micro, IEEE
(Volume:27
,
Issue:
1
)
Date of Publication: Jan.-Feb. 2007
- Page(s):
- 77 - 83
- ISSN :
- 0272-1732
- INSPEC Accession Number:
- 9499099
- Digital Object Identifier :
- 10.1109/MM.2007.1
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 21 May 2007
- Issue Date :
- Jan.-Feb. 2007
- Sponsored by :
- IEEE Computer Society
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