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3D Integration for Introspection

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6 Author(s)
Mysore, S. ; Dept. of Comput. Sci., California Univ., Santa Barbara, CA ; Agrawal, B. ; Srivastava, N. ; Sheng-Chih Lin
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In today's complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on" analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive

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Micro, IEEE  (Volume:27 ,  Issue: 1 )