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Thermomechanical Multiscale Modelling of Substrates

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4 Author(s)
Ubachs, R.L.J. ; Dept. of Precision & Microsyst. Eng., Delft Univ. of Technol., Delft ; van der Sluis, O. ; van Driel, W.D. ; Zhang, G.Q.

For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.

Published in:

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Date of Conference:

16-18 April 2007