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Electrical Contact Resistance Degradation of a Hot-Switched Simulated Metal MEMS Contact

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2 Author(s)
Daniel J. Dickrell ; Florida Univ., Gainesville, FL ; Michael T. Dugger

Electrical contact resistance testing was performed by hot-switching a simulated gold-platinum metal microelectromechanical systems contact. The experimental objective was to determine the sensitivity of the contact resistance degradation to current level and environment. The contact resistance increased sharply after 100hot-switched cycles in air. Hot-switching at a reduced current and in nitrogen atmosphere curtailed contact resistance degradation by several orders of magnitude. The mechanism responsible for the resistance degradation was found to be arc-induced decomposition of adsorbed surface contaminants

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:30 ,  Issue: 1 )