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Package-Level Integrated LTCC Antenna for RF Package Application

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7 Author(s)
Sang-Hyuk Wi ; Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul ; Jin-Seok Kim ; Nam-Kee Kang ; Jun-Chul Kim
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This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics

Published in:

IEEE Transactions on Advanced Packaging  (Volume:30 ,  Issue: 1 )