By Topic

Sensitivity Design of DL-WLCSP Using DOE With Factorial Analysis Technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chang-Chun Lee ; Taiwan Semicond. Manuf. Co., Hsinchu ; Shu-Ming Chang ; Kuo-Ning Chiang

Newer, faster, and smaller electronic packaging approaches with high I/O counts and more complex semiconductor devices are emerging steadily and rapidly. Wafer-level chip scaling package (WLCSP) has a high potential for future electronic packaging. However, the solder joint reliability for a large chip size of about 100 mm2 without underfill remains a troubling issue that urgently requires a solution. To this end, a double-layer WLCSP (DL-WLCSP) with stress compliant layers and dummy solder joint is adopted in this research in order to study the design parameters of enhancing the solder joint fatigue life. To ensure the validity of the analysis methodology, a test vehicle of Rambus DRAM is implemented to demonstrate the applicability and reliability of the proposed DL-WLCSP. The results of the thermal cycling in the experimental test show good agreement with the simulated analysis. Furthermore, to investigate the reliability impact of the design parameters, including solder volume, the arrangement of the die-side and substrate-side pad diameter, second compliant layer thickness, die thickness, and the printed circuit board (PCB) thickness, a design of experiment (DOE) with factorial analysis is adopted to obtain the sensitivity information of each parameter by the three-dimensional nonlinear finite-element models (FEMs). The statistics results of the analysis of variance reveal that the thickness of the second stress compliant layer and the volume of the solder joint can effectively reduce the stress concentration phenomenon, which occurs around the outer corner of the solder joint. In addition, the evident interaction between design parameters can also be obtained. The smaller thermal strains can be achieved through a better combination of design parameters of the geometry so as to provide the actual requirement of the physical information prior to manufacturing

Published in:

IEEE Transactions on Advanced Packaging  (Volume:30 ,  Issue: 1 )