By Topic

Viscoelastic Characterization of Polymer Matrix of Thermally Conductive Adhesives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Falat, T. ; Fac. of Microsystem Electron. & Photonics, Wroclaw Univ. of Technol. ; Felba, J. ; Wymyslowski, A. ; Jansen, K.M.B.
more authors

The current paper focuses on the viscoelastic behavior of two different epoxy resins which are commonly used as a matrix for thermally conductive adhesives. The paper deals with the characterization of the viscoelastic properties as well as the reaction kinetics and cure shrinkage. Simulation of contact stresses between silver filler particles then showed a large difference in stress relaxation between the two epoxy matrix materials

Published in:

Electronics Systemintegration Technology Conference, 2006. 1st  (Volume:2 )

Date of Conference:

5-7 Sept. 2006