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Mechanical considerations for reliable interfaces in next generation electronics packaging

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1 Author(s)
J. K. Hagge ; Rockwell Int. Corp., Cedar Rapids, IA, USA

The author reviews some basic mechanical design approaches available to assure reliable interfaces within and between packaging levels in the chip, package, and circuit-board assemblies. While the approaches can be applied to traditional circuit-board and hybrid assemblies emphasis is placed on the hybrid wafer-scale integration multichip module packaging technologies. It is concluded that a combination of recently available packaging materials of improved properties, recently developed improved analysis techniques, and the advantages of the new hybrid wafer-scale integration technology offers the opportunity to design significantly improved reliability into the next generation of military electronic equipment. Additionally, the equipment size and weight can be reduced significantly. A dramatic demonstration of the miniaturization possible with these technologies was made on a miniaturized version of a GPS (global positioning system) receiver

Published in:

Aerospace and Electronics Conference, 1989. NAECON 1989., Proceedings of the IEEE 1989 National

Date of Conference:

22-26 May 1989