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Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

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4 Author(s)
Johan Liu ; Dept. of Microtechnology & Nanoscience, Chalmers Univ. of Technol., Goteborg ; Yu Wang ; Morris, J. ; Kristiansen, H.

Anisotropic conductive adhesive (ACA) technology is one of the most important technologies for interconnect of electronics hardware. During the last 20 years, tremendous research and development effort has been spent on this. The purpose of this paper is to present ontology of the publications within the ACA technology since 1980. The following search fields are used for this study: ACA/ACF on glass, flexible circuits (polyester or polyimide), rigid board (FR-4), ceramic substrate, flexible circuitry interconnect to rigid, ACA/ACF on smart card applications, ACF/ACA on organic display, reliability, stress, process optimization and modeling study of ACA. The search sources that were used include: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Inspec, Electronic Components and Technology Conference series proceedings, Journal of Electronics Packaging, Soldering and surface mount technology and circuit world. The paper presents a list of the publications and abstracts of the searched results along with some comments about the importance of the paper in the topic. The purpose is simply to pinpoint the most important papers that have played significant role for the advancement of the ACA technology

Published in:

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Date of Conference:

27-29 June 2005