Cart (Loading....) | Create Account
Close category search window
 

C-4/CBGA comparison with other MLC single chip package alternatives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Puttlitz, K.J. ; IBM Microelectron, Hopewell Junction, NY, USA ; Shutler, W.F.

Future applications, will require higher I/O counts, more densification, lower cost, and greater performance. This paper demonstrates why area-array based chip-to-substrate and substrate-to-card interconnections are strategic, particularly solder bump flip chips (SBFC or C-4) and ceramic ball or column grid arrays (CBGA/CCGA), respectively. That is, SBFC are capable of high pin counts coupled with high yields, performance, and reliability. Moreover, recently introduced CBGA/CCGA interconnections provide substantial benefits over standard pin grid array (PGA) packages. Also, CBGA/CCGA packages possess the highest density achievable at the card level when utilized in conjunction with SBFC-mounted die

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 2 )

Date of Publication:

May 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.