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C-4/CBGA comparison with other MLC single chip package alternatives

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2 Author(s)
Puttlitz, K.J. ; IBM Microelectron, Hopewell Junction, NY, USA ; Shutler, W.F.

Future applications, will require higher I/O counts, more densification, lower cost, and greater performance. This paper demonstrates why area-array based chip-to-substrate and substrate-to-card interconnections are strategic, particularly solder bump flip chips (SBFC or C-4) and ceramic ball or column grid arrays (CBGA/CCGA), respectively. That is, SBFC are capable of high pin counts coupled with high yields, performance, and reliability. Moreover, recently introduced CBGA/CCGA interconnections provide substantial benefits over standard pin grid array (PGA) packages. Also, CBGA/CCGA packages possess the highest density achievable at the card level when utilized in conjunction with SBFC-mounted die

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 2 )

Date of Publication:

May 1995

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