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Analysis of a multilayered-metal thin-film transmission line

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3 Author(s)
Lih-Tyng Hwang ; Adv. Interconnect Syst. Labs., Motorola Inc., Tempe, AZ, USA ; Rinne, G.A. ; Turlik, I.

In this study, a perturbed-TEM analysis was conducted on a two-wire transmission line with a two-layered metal system that represents a typical metallurgy used in thin-film multichip modules (MCM's). Closed-form solutions were obtained for the current density, resistance, inductance, attenuation, and phase velocity. The proximity effects were clearly illustrated in the current density plots. It was shown that the increase in the attenuation and the resistance was caused by the skin effect and the power loss in the cladding conductor (copper line clad with 0.1-μm thick chromium), and the increase (decrease) in the phase velocity (internal inductance) of the thin-film lines was caused by the penetration of the magnetic field into the conductors

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 2 )

Date of Publication:

May 1995

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