Cart (Loading....) | Create Account
Close category search window
 

Multi-layered ultrasonic transducers employing air-gap structure

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yoshimoto, S. ; Dept. of Electr. & Electron. Eng., Chiba Univ., Japan ; Sakamoto, M. ; Hashimoto, Ken-Ya ; Yamaguchi, Masatsune

Aiming at developing miniaturized ultrasonic image sensors with high spatial resolution, this paper proposes multi-layered ultrasonic transducers employing air-gap structure. Theoretical analysis suggests that if the device is optimally designed, its performance is little affected by the layer supporting the air-gap structure, and that low-loss, wide-bandwidth transducers having practical mechanical strength could be developed. The transducer consisting of polymer/Pyrex-glass/ZnO/Pyrex-glass layers was fabricated, and a conversion loss of 11.6 dB and -3 dB relative bandwidth of 7.8% were obtained. The transducer was also applied to nondestructive testing, and its basic performance was shown.<>

Published in:

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on  (Volume:42 ,  Issue: 3 )

Date of Publication:

May 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.