By Topic

The effect of wirebond geometry and die setting on wire sweep

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
A. A. O. Tay ; Centre for IC Failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore ; K. S. Yeo ; J. H. Wu

An effective and convenient method is presented for describing wirebond geometry. The method employs a minimum number of geometric parameters which are directly related to the IC package design. Computational simulation of wirebond behavior with in-plane flow load is carried out. A 2-D creep flow model is used to predict the velocity distribution and the flow load acting on the wirebond. A finite element method, which allows for plastic deformation and large deflection, is used to predict the deformation of and stress distribution in the, wirebond. Comparative analyses of wirebond behavior with different die settings and loop profiles are carried out. The buckling of wirebonds with in-plane flow load is also studied. Very interesting results have been obtained. The numerical results will be useful for the optimal design of IC packages

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:18 ,  Issue: 1 )