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A micromachined array probe card-fabrication process

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3 Author(s)
Beiley, M. ; IBM Corp., Essex Junction, VT, USA ; Leung, Justin ; Wong, S.S.

A probe card designed to address future testing requirements has been demonstrated. The fabrication process is described in detail. The array probe card is a membrane style probe card fabricated from a silicon wafer with typical integrated circuit and micromachining technologies. The probe card is capable of providing a very large number of probe tips (>1000) in any format, including the array pad format, and is designed to satisfy the requirements for high speed and high resolution wafer-level testing

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )