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Browse Journals & Magazines > Components, Packaging, and Ma ...> Volume:18 Issue:1 Help

Open repair technologies for MCM-D

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2 Author(s)
Wassick, T.A. ; IBM Microelectronics, Hopewell Junction, NY, USA ; Economikos, L.

IBM has developed various technologies for repairing defects in thin film circuitry, primarily for Multichip Module (MCM) applications. This paper discusses five technologies: laser chemical vapor deposition (LCVD), wire bond, laser-sonic bonding, solder repair, and self-induced repair, with focus on the process parameters and tooling aspects of the three established in IBM's production environment

Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication: Feb 1995

Page(s):
154 - 162
ISSN :
1070-9894
INSPEC Accession Number:
4898232
Digital Object Identifier :
10.1109/96.365502
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Feb 1995
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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