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Electrical design of an MCM package for a multi-processor digital system

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5 Author(s)
Sarfaraz, A. ; IBM Microelectronics, East Fishkill, NY, USA ; Swaminathan, M. ; Crocker, Jim ; Bhatia, H.
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The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system has been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication:

Feb 1995

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