By Topic

Cracking failures in lead-on-chip packages induced by chip backside contamination

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
M. Amagai ; Texas Instrum., Oita, Japan ; H. Seno ; K. Ebe

The increasingly severe demands of concurrently increasing die size while reducing package size have made the mechanical stability of novel surface mount technologies a primary concern. Package cracks induced by interfacial delamination between the chip backside surface and the epoxy molding resin are a major failure mode in Lead-On-Chip (LOC) packages. This interfacial delamination is caused by contamination of the backside surface by the wafer tape adhesive. The physical and chemical parameters of the backside surface and tape adhesive which lead to interfacial delaminations in LOC packages are described along with a method to alleviate the problem. To investigate which adhesive attributes impacted interfacial delamination, wafer tape adhesive samples were prepared with a variety of different base polymers, oligomers, cross-linking agents, photoinitiator, and additives. The degree and type of backside contamination left by these various adhesives was determined with scanning electron microscope (SEM) and scanning acoustic tomography (SAT) techniques. The adhesive and the chip backside surfaces were characterized with viscoelastic, particle count, wafer contact angle, and atomic force microscope (AFM) measurements

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:18 ,  Issue: 1 )