By Topic

Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Basel, M.S. ; North Carolina State Univ., Raleigh, NC, USA ; Steer, M.B. ; Franzon, P.D.

A specialized packaging simulator is presented which uses an impulse response model of the interconnect network to model high speed digital systems. Behavioral models of drivers and receivers are used. A hierarchical strategy is developed which uses point modeling of discontinuities and the concept of coupling groups to facilitate tradeoffs between accuracy and run time. A new impulse response/convolution technique is developed to efficiently handle large distributed interconnect networks. With this technique, impulse response thresholding provides a smooth transition from delay modeling of interconnects to full distributed circuit simulation

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )