Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator

A specialized packaging simulator is presented which uses an impulse response model of the interconnect network to model high speed digital systems. Behavioral models of drivers and receivers are used. A hierarchical strategy is developed which uses point modeling of discontinuities and the concept of coupling groups to facilitate tradeoffs between accuracy and run time. A new impulse response/convolution technique is developed to efficiently handle large distributed interconnect networks. With this technique, impulse response thresholding provides a smooth transition from delay modeling of interconnects to full distributed circuit simulation