By Topic

Thin film transfer process for low cost MCM-D fabrication

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Narayan, C. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Purushothaman, S. ; Doany, F. ; Deutsch, A.

This paper describes a unique, highly flexible cost competitive method to fabricate microelectronic packages that require thin film interconnections. The method involves fabricating thin film metal/polymer structures multi-up on a reusable temporary glass carrier; the thin film stack is transferred later onto product substrates of choice. The final product substrate can be silicon, co-fired alumina or glass-ceramic, aluminum nitride, diamond, or a printed wiring board. Optionally, one can also use the released thin film decal as a flexible high wireability interconnect by itself, as an interposer, or in applications like wafer level testing for known good die (KGD). The thin film wiring structure can be fabricated multi-up on a standardized form factor carrier (independent of the characteristics of the final product substrate) in a thin film interconnect foundry, thus significantly reducing cost both from the economies of scale and full utilization of the thin film factory for a variety of customer needs

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )