Cart (Loading....) | Create Account
Close category search window
 

Large format fabrication-a practical approach to low cost MCM-D

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
White, G. ; IBM Microelectronics, Hopewell Junction, NY, USA ; Perfecto, E. ; McHerron, D. ; DeMercurio, T.
more authors

The IBM Microelectronics Division at East Fishkill has recently demonstrated the fabrication of thin films for MCM-D on large area panels, 300 mm×300 mm in size. Fabrication of the thin films was accomplished on IBM's 300 mm development line using immersion development of photosensitive polyimide for via formation and electrolytic plating to define wiring and terminal metal levels. One plane pair of thin films was constructed on Corning glass 7059 panels for 35 μm lines on 85 μm pitch. In addition, two metal-dielectric levels with 13 μm lines on 25 μm pitch have also been demonstrated. The 25 μm pitch represents the most aggressive groundrule practised in electronic packaging today. The successful production of electrically good substrates at a high yield from a 300 mm panel provides a gateway to significant cost reductions of future MCM-D products. This paper discusses the processes and equipment used to fabricate two different test vehicles, as well as some of the cost and yield considerations associated with large area panel processing for MCM-D packages

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication:

Feb 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.