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Characterization of polyimides used in high density interconnects

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2 Author(s)
Pecht, M. ; CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA ; Xin Wu

Each of the three different polyimide films used in General Electric and Texas Instrument high-density interconnects has been characterized in terms of its out-of-plane and in-plane coefficient of thermal expansion, glass transition temperature, storage modulus, loss factor, and stress-strain and creep behavior, as a function of temperature and, as appropriate, deformation rate. This paper discusses these factors and the failure mechanisms of Kapton and ULTEM films in tensile tests

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:17 ,  Issue: 4 )