By Topic

The signal transmission characteristics of embedded microstrip transmission lines over a meshed ground plane in copper/polyimide multichip module

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Chung-Ping Chien ; Interconnect Technol., Boeing Defense & Space Group, Seattle, WA, USA ; A. F. Burnett ; J. M. Cech ; M. H. Tanielian

The high-speed digital signal transmission characteristics of a microstrip transmission line in a meshed ground plane environment were studied. It is found that ground plane geometry significantly affects the degree of crosstalk noise between two adjacent signal lines and the characteristic impedance of a transmission line. A signal conductor over a meshed ground plane exhibits less degradation in rise time and voltage amplitude, compared to a line over a solid ground plane, due to the lower line capacitance and lower conductor loss. However, the longer current path in the case of a meshed ground plane increases the overall line inductance which results in a slower propagation velocity. A ground plane with optimum geometric configuration, in mesh pitch and aperture, is chosen that meets system level performance requirements while still being compatible with processing constraints. The impact of transmission lines with meshed ground plane on multichip module design for digital applications is also discussed

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:17 ,  Issue: 4 )