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Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages

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12 Author(s)
Deutsch, A. ; IBM Microelectron., Hopewell Junction, NY, USA ; Swaminathan, M. ; Ree, M.-H. ; Surovic, C.W.
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The measured dielectric anisotropy of BPDA-PDA polyimide, obtained from a specially designed test vehicle, is presented. The multilayer thin-film structure is representative of its actual use in multichip carrier (MCM-D) applications both from the cross sectional dimensions and fabrication sequence point of view. Modeling is performed using finite-element and electromagnetic techniques and the effect of anisotropy on signal propagation and crosstalk are verified through time-domain measurements

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:17 ,  Issue: 4 )