Cart (Loading....) | Create Account
Close category search window
 

The MP1 network chip

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Jesshope, C. ; Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK ; Izu, C.

Reports on the successful fabrication of a network chip for large-scale parallel computers. It provides extremely low-latency message delivery in grids of up to 1024 processors or toruses of up to 256 processors. Larger arrays can be constructed using an address embedding technique and the gateway channels supported by the chip. This adds little additional cost in terms of latency. The chip supports, without processor intervention, a number of message consumption modes including point-to-point and broadcast message delivery to the processor. The chip provides deadlock-free, adaptive routing over all shortest paths. It has been fabricated in 1.2 micron CMOS and operates at 25 MHz. We have constructed a 16-node backplane using this chip to demonstrate its operation in a heterogeneous message-passing MIMD computer

Published in:

Parallel and Distributed Processing, 1993. Proceedings. Euromicro Workshop on

Date of Conference:

27-29 Jan 1993

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.