By Topic

Mechanisms of anodic bonding of silicon to pyrex glass

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
K. B. Albaugh ; IBM Gen. Technol. Div., Essex Junction, VT, USA ; P. E. Cade ; D. H. Rasmussen

The mechanisms of formation of anodic bonds between glasses and metals are examined. The process is found to be an electrochemical analog to thermal glass-to-metal seals, where the metal surface is oxidized into the glass due to the development of large electric fields across the anodic depletion layer. The current vs. time transient at constant voltage contains a significant amount of information regarding the process mechanisms, which are predominantly electrochemical.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988