By Topic

Calibrated measurements of elastic limit, modulus, and the residual stress of thin films using micromachined suspended structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
F. Maseeh ; Microsyst. Technol. Lab., MIT, Cambridge, MA, USA ; M. A. Schmidt ; M. G. Allen ; S. D. Senturia

Calibration of the suspended square membrane method using both finite-element methods (FEM) and comparison with conventional tensile tests is discussed. The use of suspended circular membranes to measure the elastic limit of thin films is reported. The techniques can be adapted to other thin films from which microfabricated specimens can be made. The Instron test results provided useful information about the material behavior, including Young's modulus, whereas the membranes were used to determine quantitative values for residual stress and elastic modulus. The axisymmetric state of circular membranes under pressure were utilized effectively in determining the elastic limit of thin polymer films.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988