By Topic

Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Guckel, H. ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA ; Burns, D.W. ; Tilmans, H.A.C. ; Visser, C.C.G.
more authors

The processing conditions to obtain high-quality and repeatable polysilicon films are described. These include substrate preparation, the deposition procedure, reactor configuration, and postdeposition treatment. Examples of large-aspect-ratio microstructures such as long, thin beams and tuning forms for sensor applications and large-area diaphragms for piezoresistive microphones and X-ray masks are presented to illustrate the potential of polysilicon films that are in tension.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988