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Plasma polymerization of methyl methacrylate: a photoresist for 3D applications

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7 Author(s)
H. Guckel ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA ; J. Uglow ; M. Lin ; D. Denton
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The use of plasma polymerized methyl methacrylate (PPMMA) as a deep UV photoresist is described. By depositing a light sensitive polymer film from a plasma, very irregular surfaces can be coated and patterned. Other key parameters for a photoresist are photosensitivity, stability, selectivity, and resolution. These parameters are used here as a means of optimizing the plasma process, exposure, and development cycle. The optimum process sequence results in stable films which withstand subsequent exposure to acetone and isopropyl alcohol, have a line width resolution of at least 1.5 mu m, and have a selectivity of at least 70%.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988