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Key technologies for future IC manufacturing: a view from Europe

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1 Author(s)
M. Van Rossum ; MEC, Leuven

Current European development trends in IC processing technologies are reviewed. Most research projects are presently carried out in the EEC framework (IESSI-ESPRIT), which therefore acts as a trendsetter in the field of submicron processing. Major efforts are devoted to the improvement of process control at sub-0.5-μm dimensions. Examples can be found in lithography and in the fields of rapid thermal processing (RTP), junction formation and ultraclean processing. In the area of metallization, two trends are clearly identified: the introduction of cluster tools and the shift from sputter deposition to CVD. Finally, CAD techniques are under development for improved process control in IC manufacturing

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Date of Conference:

30 Sep-1 Oct 1992