By Topic

Processing, characterization, and potential applications of YBa/sub 2/Cu/sub 3/O/sub 7//Au and YBa/sub 2/Cu/sub 3/O/sub 7//Au/Si superconducting thin films fabricated by rapid isothermal processing assisted metalorganic chemical vapor deposition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Singh, R. ; Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA ; Ng, J.T.C. ; Singh, R.K. ; Qian, F.
more authors

Rapid-isothermal processing (RIP)-assisted metalorganic chemical vapor deposition (MOCVD) has been used for the deposition of high-quality films of YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) on insulating substrates at temperatures as low as 610 degrees C. The results of processing and characterization of YBCO films deposited on bulk gold foils and Au/Si substrates by RIP-assisted MOCVD are reported. By the use of YBCO/Au foils, improvement in the performance of Au/YBCO/n-Si Schottky diodes operating at 50 K is achieved.<>

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:3 ,  Issue: 1 )