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New analytical study for popcorn phenomenon [package cracking]

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6 Author(s)
Kimura, H. ; Nitto Denko Corp., Mie, Japan ; Yoshida, T. ; Ohizumi, S. ; Nishioka, T.
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Package cracking during soldering is considered. This cracking is classified by two mechanisms. One mechanism is a classical MODE-I, whereby delamination originates under the die pad and propagates in most cases to the package's outer surface. The other is MODE-II cracking which starts from delamination at the die attach material interface. A simulated method of MODE-II cracking is established. Using this method, suitable properties of encapsulant to prevent MODE-II cracking are presented. These properties led to the development of a new molding compound, which has excellent resistance to MODE-II cracking

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 6 )