Referenced Items are not available for this document.
Package cracking during soldering is considered. This cracking is classified by two mechanisms. One mechanism is a classical MODE-I, whereby delamination originates under the die pad and propagates in most cases to the package's outer surface. The other is MODE-II cracking which starts from delamination at the die attach material interface. A simulated method of MODE-II cracking is established. Using this method, suitable properties of encapsulant to prevent MODE-II cracking are presented. These properties led to the development of a new molding compound, which has excellent resistance to MODE-II cracking
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:15
,
Issue:
6
)
Date of Publication: Dec 1992
- Page(s):
- 1117 - 1122
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4419572
- Digital Object Identifier :
- 10.1109/33.206938
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1992
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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