Referenced Items are not available for this document.
The reliability assessment of a high-lead-count tape automated bonding (TAB) package using advanced packaging technology is described. The package was developed to replace existing leaded chip carriers for high I/O and high-performance applications. The package technology uses Au bumps and Au-plated, single-metal two-layer 70-mm Cu tape with a polyimide support ring. After inner lead bonding and chip encapsulation, the chip-on-tape was epoxy attached to a ceramic base and lid. This clamshell design provided both mechanical and environmental protection to the integrated circuit device
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:15
,
Issue:
6
)
Date of Publication: Dec 1992
- Page(s):
- 1105 - 1116
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4419571
- Digital Object Identifier :
- 10.1109/33.206937
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1992
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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