By Topic

Correlation of silver migration with temperature-humidity-bias (THB) failures in multilayer ceramic capacitors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ling, H.C. ; AT&T Bell Lab., Princeton, NJ, USA ; Jackson, A.M.

The normal voltage failures in multilayer ceramic capacitors (MLC) using the temperature-humidity-bias test (THB) are described. The cumulative failure data showed that the MLC failures occurred in several stages during the THB test, with the extent of failures depending on the quality of the capacitor lot and the bias voltage. THB failures increased after some of the MLC lots had undergone a barrel-plating operation, indicating moisture penetration and ionic contaminants as the likely cause of accelerating the failure rate. In the cross section of failed MLC, the authors observed large holes caused by high-temperature explosive events occurring inside the MLC. There were also internal cracks connecting electrodes of opposite polarity, with silver inclusions along the length of the cracks. These observations strongly suggested that silver migration was the cause of short-circuit paths, leading to subsequent failure of the MLC.<>

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:12 ,  Issue: 1 )