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Hybrid integration of surface-emitting microlaser chip and planar optics substrate for interconnection applications

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6 Author(s)
Jahns, J. ; AT&T Bell Lab., Holmdel, NJ, USA ; Morgan, R.A. ; Nguyen, H.N. ; Walker, J.A.
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The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.<>

Published in:

Photonics Technology Letters, IEEE  (Volume:4 ,  Issue: 12 )