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Packaging Trends and New Materials Challenges

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Summary form only given. In this presentation, I will summarize the system, IC and package trends in the microelectronics industry, and the accompanying new material challenges as the IC miniaturizes, more new systems are introduced to the market, and as a greater variety of new packages continues to be churned out at an ever-higher rate. Adding to the complexity are the ever-present low cost pressures, linking everything we do to cost from design to production, as well as the ever-more stringent "green" requirements placed on these new materials. All these translate to the needs to designing and producing the new materials under a new mindset and perhaps a new set of methodologies

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2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface

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