Referenced Items are not available for this document.
Summary form only given. Semiconductor packaging materials are a key to the success of the semiconductor business in total. Changes in consumer electronics are driving the changes in packaging materials. This presentation highlights the market growth and trends in laminate substrates, lead frames, wafer level packaging dielectrics, bonding wire, encapsulants and molding compounds, thermal interface materials, and solder spheres. The impact of today's BT-resin shortage, laminate substrate shortage, and the rising prices of metals are discussed
Published in:
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Date of Conference: 0-0 0
- Page(s):
- 34
- ISSN :
- 1550-5723
- Print ISBN:
- 1-4244-0260-3
- INSPEC Accession Number:
- 9089434
- Conference Location :
- Atlanta, GA
- Digital Object Identifier :
- 10.1109/ISAPM.2006.1665983
- Product Type:
- Conference Publications
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