Referenced Items are not available for this document.
Back-side alignment was implemented in the thick layer process flow for the production of advanced power devices. The alignment and overlay performance of the back-side alignment scheme are addressed, as well as the benefits in terms of productivity and cost reduction
Published in:
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Date of Conference: 22-24 May 2006
- Page(s):
- 104 - 107
- ISSN :
- 1078-8743
- Print ISBN:
- 1-4244-0254-9
- INSPEC Accession Number:
- 9075253
- Conference Location :
- Boston, MA
- Digital Object Identifier :
- 10.1109/ASMC.2006.1638732
- Product Type:
- Conference Publications
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