By Topic

Programmable reconfigurable self-assembly: parallel heterogeneous integration of chip-scale components on planar and nonplanar surfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Chung, Jaehoon ; Dept. of Electr. Eng., Univ. of Minnesota, Minneapolis, MN, USA ; Wei Zheng ; Hatch, T.J. ; Jacobs, H.O.

This paper reports on a programmable reconfigurable self-assembly (PRS) process to enable heterogeneous integration of components on nonplanar substrates. The proposed process makes use of solder-based receptors that can be activated electrically. Metal contacts on segmented semiconductor devices bind to liquid-solder-based-receptors on a substrate during the fluidic self-assembly. Programmability is implemented using solder-based receptors that can be switched "ON" and "OFF" using integrated heaters. We have evaluated the feasibility of the proposed PRS concept through computer simulations using ANSYS to estimate: i) the necessary power to heat selected receptors to above the melting point of the solder and ii) the minimal spacing between receptors for preventing thermal crosstalk. A prototype platform has been fabricated to experimentally test the PRS process. The programmable sequential assembly of multiple types of components onto target positions has been demonstrated, including 300-μm-sized light-emitting diodes (LEDs) and silicon dies. Three types of defects were identified and eliminated using improved component designs, transient heating, and adequate heat sinks. A prototype color LED display segment that contains a total of 36 red, green, and yellow LED segments and 72 interconnects has been used to test the concept. The outlined process provides a new concept to the parallel integration of microdevices and systems that require electrical interconnects between components.

Published in:

Microelectromechanical Systems, Journal of  (Volume:15 ,  Issue: 3 )