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Solder connections for high frequency applications between flexible and rigid printed circuit boards

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1 Author(s)
W. P. Siebert ; Dept. of Inf. Technol. & Media, Mid Sweden Univ., Ostersund, Sweden

This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:29 ,  Issue: 1 )