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Applying material optimization to fracture mechanics analysis to improve the reliability of the plastic IC package in reflow soldering process

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2 Author(s)
Geun Woo Kim ; Sch. of Mech. Eng., Yonsei Univ., Seoul, South Korea ; Kang Yong Lee

To prevent crack propagation in a plastic small outline J-lead package with a dimpled diepad under an IR soldering process, parametric study and optimization with respect to material properties are done. The main design variables among all material properties are determined from the parametric study. Their optimized values are determined by applying a constraint optimization technique to the IC package.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:29 ,  Issue: 1 )