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The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

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6 Author(s)
Pan, G.-W. ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Milwaukee, WI, USA ; Prentice, J.A. ; Zahn, S.K. ; Staniszewski, A.J.
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The development of a comprehensive electromagnetic (EM) modeling tool, the Networking Algorithm, is discussed. This tool is capable of simulating on a digital computer the complexities inherent in real-world interconnects and packages, including simultaneous treatment of the effects of mixed types of transmission line interconnects (i.e. mixtures of stripline, microstrip, and coplanar lines), stubs and branches, reflections, and crosstalk between multiple nets. The type of modeling tool which has been developed is described, the mathematics of the Networking Algorithm is discussed, and a number of examples taken from a high-frequency digital package design are given to show how such a computer-based EM modeling tool set can assist in the design of high-performance packages

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 4 )