By Topic

The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
G. -W. Pan ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Milwaukee, WI, USA ; J. A. Prentice ; S. K. Zahn ; A. J. Staniszewski
more authors

The development of a comprehensive electromagnetic (EM) modeling tool, the Networking Algorithm, is discussed. This tool is capable of simulating on a digital computer the complexities inherent in real-world interconnects and packages, including simultaneous treatment of the effects of mixed types of transmission line interconnects (i.e. mixtures of stripline, microstrip, and coplanar lines), stubs and branches, reflections, and crosstalk between multiple nets. The type of modeling tool which has been developed is described, the mathematics of the Networking Algorithm is discussed, and a number of examples taken from a high-frequency digital package design are given to show how such a computer-based EM modeling tool set can assist in the design of high-performance packages

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:15 ,  Issue: 4 )