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A novel multichip module assembly approach using gold ball flip-chip bonding

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2 Author(s)
Goodman, C.E. ; Motorola Inc., Schaumburg, IL, USA ; Metroka, M.P.

A multichip module (MCM) approach that dramatically reduces the circuit area of a portable communications transceiver is described. The MCM incorporated a 1-in square (2.54-cm square) silicon substrate fabricated with thin-film resistors and a double-metal linear process technology. The die bonding was performed with a flip-chip process that uses unmodified, off-the-shelf ICs. The process is performed using standard wirebonding equipment and a thermocompression flip-chip bond. The resulting MCM reduced the required circuit board area by 40%

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 4 )