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Ultra-Dense: an MCM-based 3-D digital signal processor

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6 Author(s)
J. M. Segelken ; AT&T Bell Labs., Murray Hill, NJ, USA ; L. J. Wu ; M. Y. Lau ; K. L. Tai
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The DSP3 Multiprocessor Project has produced a multi-GFLOP machine that is applicable to a variety of signal processing and pattern recognition problems. A companion program, the Ultra-Dense Project, is utilizing silicon-on-silicon multichip module (MCM) technology and innovative advanced packaging and physical design to achieve a parallel three-dimensional digital signal processor based on the DSP3. The authors present an overview and outline systems architecture the micro-interconnect technology (Si-on-Si MCM), and advances in physical design and packaging technology leading to an ultra-dense project demonstration

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:15 ,  Issue: 4 )