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Overview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module

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2 Author(s)
Tummala, R.R. ; IBM Corp., Hopwell Junction, NY, USA ; Ahmed, S.

The ES/9000 models 820 and 900 high-performance mainframe processors have been significantly enhanced with respect to their predecessors, due to the following packaging advances: multilayer glass-ceramic/copper cofired substrate; multilayer polyimide/copper thin-film structure; discrete decoupling capacitors; buried engineering change conductors; enhanced pistons for very high thermal conduction cooling; and enhanced flip-chip solder connections. Some aspects of these advances are examined. The connectors and printed wiring board technologies used in this family of systems are summarized

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 4 )

Date of Publication:

Aug 1992

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