By Topic

The story behind the red phosphorus mold compound device failures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yuliang Deng ; Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA ; M. Pecht

A family of mold compounds with red phosphorus flame retardant was introduced as an environmentally-friendly encapsulant for semiconductor devices. However, these mold compounds introduced product failures, including current leakage and resistive shorts between adjacent leads inside the leaded semiconductor device package, and resistance increases and open circuits of the wire bonds. This paper presents the family of mold compounds with the red phosphorus flame retardant, the failure mechanisms and the root cause of the failures.

Published in:

2005 International Symposium on Electronics Materials and Packaging

Date of Conference:

11-14 Dec. 2005