Mechanical Properties for 95.5Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy

Mechanical properties for 95.5Sn–3.8Ag–0.7Cu solder alloy were derived from bulk specimen tensile test and lap shear solder joint tests specimen. The tensile tests were carried out at three temperatures (25
$^circhbox C$
, 75
$^circhbox C$
, and 125
$ ^circhbox C$
) and at three different strain rates (
$5.6times 10^-4 hbox s^-1$
,
$5.6times 10^-3$
and
$5.6times 10^-2 hbox s^-1$
). Shear tests were carried out at three temperatures (25
$ ^circhbox C$
, 75
$ ^circhbox C$
, and 125
$ ^circhbox C$
) and at three different displacement rates (0.5, 0.05, and 0.005 mm/min). The specimen gave the highest strength at the fastest displacement rate and at room temperature of 25
$ ^circhbox C$
(0.61 Tm). The lowest strength occurs when the specimen is subjected to the slowest displacement rate at elevated temperature of 125
$ ^circhbox C$
(0.81 Tm). Constant-load creep tests for bulk specimen were also conducted at three different temperatures (25
$ ^circhbox C$
, 75
$ ^circhbox C$
, and 125
$ ^circhbox C$
), test results were compared with other reported data.