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ESD-induced internal core device failure: new failure modes in system-on-chip (SOC) designs

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7 Author(s)
Huh, Yoon ; Global Technol. Leader, Santa Clara, CA, USA ; Bendix, P. ; Kyungjin Min ; Jau-Wen Chen
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With MOSFET scaling, increased design complexity, and multiple system power domains, ESD failures occur in internal core areas which are not connected to external package pins. A review of the various internal core device failure mechanisms and design recommendations are presented.

Published in:

System-on-Chip for Real-Time Applications, 2005. Proceedings. Fifth International Workshop on

Date of Conference:

20-24 July 2005