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This paper presents the introduction of the nonhermetic encapsulation of microwave hybrids for space application. Thanks to the improvement for many years now of organic materials, it is now realistic to propose a glob top encapsulation of GaAs MMIC on printed circuit boards. To validate this packaging approach, a reliability test-plan is proposed based on humidity tests, life tests and thermal cyclings in agreement with standard space quality requirements. Six modules per test-file have been manufactured. No failures are reported by visual inspection and on electrical characteristics at the end of the three test-files.
Date of Conference: 12-17 June 2005