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Parylene-strengthened thermal isolation technology for microfluidic system-on-chip applications

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3 Author(s)
Chi-Yuan Shih ; Dept. of Electr. Eng., California Technol. Inst., Pasadena, CA, USA ; Yang Chen ; Yu-Chong Tai

Here we reported a novel technology using parylene-cross-linking structure to achieve on-chip air-gap thermal isolation for microfluidic system-on-chip (SOC) applications. Two applications based on this technology, on-chip continuous-flow polymerase chain reaction (PCR) and on-chip temperature gradient liquid chromatography (LC) were successfully demonstrated. Device thermal performance in each example was characterized. Results showed that our technology not only provides excellent on-chip thermal isolation but also its simplicity of integration with other on-chip components makes versatile microfluidic SOC applications feasible.

Published in:

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on  (Volume:2 )

Date of Conference:

5-9 June 2005