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Design, Analysis, and Development of Novel Three-Dimensional Stacking WLCSP

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5 Author(s)
Yuan, Chang-Ann ; Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Cheng Nan Han ; Ming-Chih Yew ; Chan-Yen Chou
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A robust and rapid development procedure for a novel three-dimensional stacking wafer level chip-scaled packaging (3DS-WLCSP), emphasizing the finite-element parametric analysis and experimental validation, is disclosed herein. This design procedure is comprised of the fundamental validation of conventional wafer-level chip-scaled packaging (WLCSP), design methodology development of the test vehicles and then the fabrication of the proposed 3DS-WLCSP structure. Based on the validation of the conventional WLCSP measurement and experiment, a reliable finite-element model can be achieved. However, in order to reduce the product design period, a simplified Glass-WLCSP is chosen as the test vehicle in the parametric design/validation procedure. Through the parametric analysis, one can obtain robust design parameters. Therefore, the proposed 3DS-WLCSP can be fabricated within the validated design parameters.

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Advanced Packaging, IEEE Transactions on  (Volume:28 ,  Issue: 3 )