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A silicon condenser microphone with a highly perforated backplate

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5 Author(s)
Bergqvist, J. ; Centre Swisse d''Electron. et de Microtech., S.A., Neuchatel, Switzerland ; Rudolf, F. ; Maisano, J. ; Parodi, F.
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Condenser microphone chips in monocrystalline silicon have been designed and realized with a technology that is well adapted to batch fabrication. The novel design has a thin and highly perforated backplate in combination with an air-gap of 2 mu m. The device has a low bias voltage of 5 V, a frequency response within +or-3 dB from 2 Hz to 20 kHz, and sensitivities in the range of 1 to 2 mV/Pa. Simulations with equivalent acoustical circuits agree well with experimental data up to a frequency of 15 kHz.<>

Published in:
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on

Date of Conference: 24-27 June 1991

Page(s):
266 - 269
Meeting Date :
24 Jun 1991-27 Jun 1991
Print ISBN:
0-87942-585-7
INSPEC Accession Number:
4154840
Conference Location :
San Francisco, CA, USA
Digital Object Identifier :
10.1109/SENSOR.1991.148857
Product Type:
Conference Publications

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